The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.
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In its strategic alignment 3D-Micromac concentrates particularly on international and high-growth, high-tech markets. More-than-Moore MtMSystem-in-Package SiPas well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e.
The contactless cell handling enables processing without surface defects and microcracks.
3D-Micromac Celebrates 15 Years, Opens New Building | Business | Oct |
By constantly optimizing all internal business processes, we set the course for the steady growth of our company and for a lasting partnership with our customers and suppliers.
All systems use UV lasers for permanent marking.
Microstructure diagnostics and failure analyses are pivotal for the ongoing improvement of functional materials and micrommac electronic components. Some of the technologies are being researched in cooperation with cooperation partners from the partner cluster in Yonezawa, Japan.
New company headquarter Approaches for precise local laser doping based on lean equipment concepts should be developed as well as a process based on a cost efficient infrared laser source.
The project aims to develop large-scale lighting applications using organic light-emitting diodes OLEDs on flexible substrates. The system features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional wavelength lasers near infrared, green and ultravioletresulting in a highly flexible, high-quality laser annealing platform.
The constant cost pressure in the photovoltaic industry as a continues challenge to solar cell manufacturers can only be solved by d3 cell efficiency with simultaneous reducing manufacturing costs.
3D-Micromac – Micromachining Excellence
From the founding of our company until today we have constantly been able to achieve important milestones:. Our expertise and engineering competency allow us to stand alongside our customers as reliable partners in technology and process development as well as in the development of OEM-manufacturing solutions and customer-specific systems.
Whether Standard System or Special Solution: Strategic realignment focusing on industrial growth markets Through dividing the solar cells in half cells before integrating in modules electrical losses can be reduced.
All components have to be adapted to the requirements of the new high efficiency laser processes.
These platforms are open to multiple users and for multiple applications. For this reason, 3D-Micromac continuously works micromca innovative laser processes and solutions for optimizing manufacturing processes, productivity, and effectiveness of silicon solar cells.
We are one of the first companies in the world to focus on the use of ultra-short pulse lasers for the processing of materials. Extremely precise positioning systems, innovative beam-delivery concepts as well as numerous process monitoring methods offer the highest possible process reliability and a maximum speed of machining.
Innovative laser processes are revolutionizing industrial manufacturing worldwide. This opens up a huge variety of possibilities and niche applications for BIPV. At the same time, traditional scaling of feature sizes in microelectronics is becoming increasingly cost prohibitive in order to add more functionality on devices within a smaller footprint. Our target is to completely satisfy customer demands even mlcromac the most complex projects.
Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells.
Areas of use include smartphone displays made of chemically or thermally hardened glass, camera casings or watch glasses made of sapphire glass, but also LEDs and OLEDs.
The electrical and mechanical properties of the cells after cutting are in the focus of the investigations. Firstly the developments are oriented to the state of the art.
They are characterized by extraordinary reliability and productivity, fine precision, and flexibility. The microPREP systems an be used for a variety of sample preparation techniques like SEM inspection of advanced-packaging devices, X-ray microscopy, atom probe tomography, and micro mechanics.
Although lasers are well established tools in manifold applications, they have been broadly ignored for mkcromac in sample preparation due to concerns regarding their potential for causing structural damage.
Successful market launch of production systems for the manufacturing of nozzles via excimer-laser All methods comply with the requirements of industrial display production and guarantee clean and gentle processing, without any discoloration of the material, and excellent edge quality and breakage resistance.
This has created a greater need for methods of processing surface layers of the device without affecting buried structures, as well as selective exposure of functional areas on the device. With this certification, we prove our successful quality management and the efficiency of our process chains as well as our efforts to a continuous improvement. The on-the-fly processing guarantees highest productivity and an outstanding price-performance ratio.
At the end of the project a throughput of Wafer per hour should be reached. It is only because of our laser processes that efficient series production of new and innovative components and products are made possible. The separated cells show a significantly higher mechanical strength, better edge quality and a lower power reduction compared to laser scribing and breaking approaches. Those properties should be unchanged after cutting. We also specialize in the use of excimer lasers for microprocessing.
Winner of the Saxon Innovation Prize More than excimer laser systems produced by 3D-Micromac AG are currently in industrial use. Today, however, the use of ultrashort pulses and optimized processing routes is addressing these concerns and enabling laser processing to finally enter the scene — speeding up microstructure diagnostics and failure analysis as well as opening up access to deeply buried structures and large-area preparation.
We Optimize your Processes! A main aspect in technological developments for photovoltaics is the reduction of cost per power of the solar panel. With the growing adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions and larger-size substrates, wafer dicing is evolving as a critical value-add process step that not only ensures, but also further enhances, semiconductor device yields.